Module-side and Host-side optical interconnect solutions for next-generation high-density optical networks
Reliable fiber connection, easy maintenance, high-volume production ready
High-reliability host-side interconnect with advanced locking and protection
Recommended ultra-low-loss MT-Ferrule series for ELSFP optical interconnect applications
Max. ≤ 0.20 dB
Avg. ≤ 0.08 dB
Max. ≤ 0.25 dB
Avg. ≤ 0.10 dB
Coming Next: Thermal Conductive Ferrule for enhanced heat dissipation
Module-side and Host-side connector 3D assembly animations
Host Assembly
Host Explosion
Module Assembly
Module Explosion
Module Total Length
9.6 mm / 10.9 mm Max.
Shell Material
Zinc Alloy + PEI
Retention Force
≥ 40 N (integrated hook & body)
Supported Channels
12CH / 16CH SM
12CH SM Insertion Loss
Max. ≤ 0.20 dB, Avg. ≤ 0.08 dB
16CH SM Insertion Loss
Max. ≤ 0.25 dB, Avg. ≤ 0.10 dB
Alignment
4× Guide Pin, dual-stage
Compliance
OIF-ELSFP Protocol
Comprehensive testing and assembly equipment to support customer qualification and volume production